U630H04BDK45G1 vs U630H04BSC25 feature comparison

U630H04BDK45G1 ZMDI

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U630H04BSC25 ZMDI

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP28,.4
Pin Count 28 24
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 25 ns
JESD-30 Code R-PDIP-T28 R-PDSO-G24
Length 34.7 mm 15.4 mm
Memory Density 4096 bit 4096 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 24
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
Base Number Matches 3 3
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code SOP28,.4
Standby Current-Max 0.001 A
Supply Current-Max 0.09 mA
Terminal Finish TIN LEAD

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