U630H04BDK45G1 vs U630H04BDK45 feature comparison

U630H04BDK45G1 Simtek Corporation

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U630H04BDK45 ZMDI

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIMTEK CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Package Description DIP, DIP, DIP28,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Length 34.7 mm 34.7 mm
Memory Density 4096 bit 4096 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 3
Rohs Code No
Part Package Code DIP
Pin Count 28
JESD-609 Code e0
Package Equivalence Code DIP28,.3
Standby Current-Max 0.001 A
Supply Current-Max 0.08 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare U630H04BDK45G1 with alternatives

Compare U630H04BDK45 with alternatives