U6264ADK10 vs CXK5864BSP-10L feature comparison

U6264ADK10 ZMDI

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CXK5864BSP-10L Sony Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG SONY CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 0.300 INCH, PLASTIC, MO-058AB, DIP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.1 mm 35.1 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 4.4 mm
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.06 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Number of Ports 1
Output Enable YES
Standby Current-Max 0.000035 A

Compare U6264ADK10 with alternatives

Compare CXK5864BSP-10L with alternatives