U621708TK07 vs 8959836BZC feature comparison

U621708TK07 ZMDI

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8959836BZC Micross Components

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG AUSTIN SEMICONDUCTOR INC
Part Package Code TSOP1 DIP
Package Description TSSOP, DIP,
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 35 ns
JESD-30 Code R-PDSO-G32 R-CDIP-T32
JESD-609 Code e0 e4
Length 11.8 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 4.34 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm 10.16 mm
Base Number Matches 2 1
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES

Compare U621708TK07 with alternatives

Compare 8959836BZC with alternatives