TTSI1K16T3TL
vs
DS26502LN+
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
AVAGO TECHNOLOGIES INC
MAXIM INTEGRATED PRODUCTS INC
Package Description
LFQFP,
10 X 10 MM, 1.40 MM HEIGHT, LQFP-64
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G144
S-PQFP-G64
JESD-609 Code
e0
e3
Length
20 mm
10 mm
Number of Functions
1
1
Number of Terminals
144
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Telecom IC Type
TIME SLOT ASSIGNER
FRAMER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
20 mm
10 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
64
ECCN Code
EAR99
Carrier Type
CEPT PCM-30/E-1
Carrier Type (2)
T-1(DS1)
Moisture Sensitivity Level
3
Package Equivalence Code
QFP64,.47SQ,20
Supply Current-Max
150 mA
Compare TTSI1K16T3TL with alternatives
Compare DS26502LN+ with alternatives