TTMM78C29W/883
vs
MM78C29W/883C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TWILIGHT TECHNOLOGY INC
|
NATIONAL SEMICONDUCTOR CORP
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
NO
|
NO
|
Driver Number of Bits |
4
|
4
|
High Level Input Current-Max |
0.000001 A
|
0.000001 A
|
JESD-30 Code |
R-XDFP-F14
|
R-XDFP-F14
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Out Swing-Min |
3 V
|
3 V
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DFP
|
DFP
|
Package Equivalence Code |
FL14,.3
|
FL14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883 Class C
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Transmit Delay-Max |
200 ns
|
200 ns
|
Base Number Matches |
1
|
2
|
Package Description |
|
DFP, FL14,.3
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TTMM78C29W/883 with alternatives
Compare MM78C29W/883C with alternatives