TTMM54HC157J/883B
vs
MM74HC157J
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
3
Part Package Code
DIP
Pin Count
16
Family
HC/UH
JESD-609 Code
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
Number of Outputs
1
Output Polarity
TRUE
Propagation Delay (tpd)
32 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Width
7.62 mm
Compare TTMM54HC157J/883B with alternatives
Compare MM74HC157J with alternatives