TSXPC860SRVZPU66D vs TSXPC860SRMZPU66D4 feature comparison

TSXPC860SRVZPU66D Atmel Corporation

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TSXPC860SRMZPU66D4 Atmel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA357,19X19,50 BGA,
Pin Count 357 357
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 357 357
Operating Temperature-Max 110 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 2.05 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2

Compare TSXPC860SRVZPU66D with alternatives

Compare TSXPC860SRMZPU66D4 with alternatives