TSXPC860SRVZPU66D
vs
XPC860ENCZP66D3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA357,19X19,50
BGA, BGA357,19X19,50
Pin Count
357
357
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
JESD-609 Code
e0
e0
Length
25 mm
25 mm
Low Power Mode
YES
Number of Terminals
357
357
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.05 mm
Speed
66 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
SoC
Base Number Matches
1
3
Compare TSXPC860SRVZPU66D with alternatives
Compare XPC860ENCZP66D3 with alternatives