TSXPC860MHMZPU40C1 vs TSPC860MHVZPU40B feature comparison

TSXPC860MHMZPU40C1 Atmel Corporation

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TSPC860MHVZPU40B Thales Group

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA BGA
Package Description BGA, ,
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm
Low Power Mode YES NO
Number of Terminals 357 357
Operating Temperature-Max 125 °C 110 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3

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