TSPC860MHVZPU40B
vs
TSXPC860SRVZP40D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
,
PLASTIC, BGA-357
Pin Count
357
357
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Low Power Mode
NO
YES
Number of Terminals
357
357
Operating Temperature-Max
110 °C
110 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
40 MHz
40 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Length
25 mm
Package Equivalence Code
BGA357,19X19,50
Seated Height-Max
2.05 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
25 mm
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