TSXPC603RCA6LC
vs
TSPC603RCA6LC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
QFP
QFP
Package Description
,
FQFP, QFP240,1.3SQ,20
Pin Count
240
240
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.7 MHz
66.7 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-GQFP-G240
S-GQFP-G240
Low Power Mode
YES
YES
Number of Terminals
240
240
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
QFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Speed
166 MHz
166 MHz
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Length
31 mm
Package Equivalence Code
QFP240,1.3SQ,20
Seated Height-Max
4.15 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
0.5 mm
Width
31 mm
Compare TSXPC603RCA6LC with alternatives
Compare TSPC603RCA6LC with alternatives