TSPC860SRMZQU66D vs MPC860TZQ50D4R2 feature comparison

TSPC860SRMZQU66D Teledyne e2v

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MPC860TZQ50D4R2 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TELEDYNE E2V (UK) LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count 357 357
Reach Compliance Code compliant not_compliant
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm 25 mm
Low Power Mode YES YES
Number of DMA Channels 16
Number of Serial I/Os 4
Number of Terminals 357 357
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50 BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.75 mm 2.52 mm
Speed 66 MHz 50 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Clock Frequency-Max 50 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MPC860TZQ50D4R2 with alternatives