TSPC860SRMZQU66D vs MPC860DCZP40 feature comparison

TSPC860SRMZQU66D Atmel Corporation

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MPC860DCZP40 Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP MOTOROLA INC
Part Package Code BGA
Package Description 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 BGA,
Pin Count 357
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES
External Data Bus Width 32 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES
Number of Terminals 357 357
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.05 mm
Speed 66 MHz 40 MHz
Supply Voltage-Max 3.465 V 3.78 V
Supply Voltage-Min 3.135 V 2.85 V
Supply Voltage-Nom 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn62Pb36Ag2)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Clock Frequency-Max 40 MHz

Compare TSPC860SRMZQU66D with alternatives

Compare MPC860DCZP40 with alternatives