Findchips: Compare TSPC860SRMZP40D vs TSPC860MHMZPU40D4

TSPC860SRMZP40D vs TSPC860MHMZPU40D4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	ATMEL CORP	TELEDYNE E2V (UK) LTD
Part Package Code	BGA	BGA
Package Description	PLASTIC, BGA-357	BGA,
Pin Count	357	357
Reach Compliance Code	unknown	compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	40 MHz	40 MHz
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
JESD-609 Code	e0
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	357	357
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA357,19X19,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.05 mm	2.05 mm
Speed	40 MHz	40 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	2	2
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors