Part Details for TSXPC860MHVZPU40B by Microchip Technology Inc
Overview of TSXPC860MHVZPU40B by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXPC860MHVZPU40B
TSXPC860MHVZPU40B CAD Models
TSXPC860MHVZPU40B Part Data Attributes
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TSXPC860MHVZPU40B
Microchip Technology Inc
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Datasheet
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TSXPC860MHVZPU40B
Microchip Technology Inc
RISC Microprocessor, 32-Bit, 40MHz, PBGA357
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | PLASTIC, BGA-357 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 40 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC860MHVZPU40B
This table gives cross-reference parts and alternative options found for TSXPC860MHVZPU40B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC860MHVZPU40B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC860SRMZP40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSPC860SRMZP40D |
| TSPC860MHVZPU40C1 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSXPC860MHVZPU40B vs TSPC860MHVZPU40C1 |
| TSXPC860MHVZPU40C1 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSXPC860MHVZPU40C1 |
| TSXPC860MHVZPU40C1 | RISC Microprocessor, 32-Bit, 40MHz, PBGA357 | Microchip Technology Inc | TSXPC860MHVZPU40B vs TSXPC860MHVZPU40C1 |
| TSXPC860SRVZPU40C1 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSXPC860SRVZPU40C1 |
| TSPC860MHMZPU40D4 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSPC860MHMZPU40D4 |
| TSPC860SRMZPU/T40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSPC860SRMZPU/T40D |
| TSXPC860SRMZP40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU40B vs TSXPC860SRMZP40D |
| TSPC860SRMZPU/T40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSXPC860MHVZPU40B vs TSPC860SRMZPU/T40D |
| TSPC860SRVZP40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSXPC860MHVZPU40B vs TSPC860SRVZP40D |