TSPC860MHVGU50C
vs
TSPC860SRVZP66D
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
ATMEL CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
,
|
PLASTIC, BGA-357
|
Pin Count |
357
|
357
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B357
|
S-PBGA-B357
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
357
|
357
|
Operating Temperature-Max |
110 °C
|
110 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
50 MHz
|
66 MHz
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
3.135 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
25 mm
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA357,19X19,50
|
Seated Height-Max |
|
2.05 mm
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
25 mm
|
|
|
|
Compare TSPC860MHVGU50C with alternatives
Compare TSPC860SRVZP66D with alternatives