Findchips: Compare TSPC860MHMGB/Q40A3 vs MPC860TZQ80D4

TSPC860MHMGB/Q40A3 vs MPC860TZQ80D4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	ATMEL GRENOBLE	NXP SEMICONDUCTORS
Part Package Code	BGA
Package Description	,	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count	357
Reach Compliance Code	unknown	not_compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	40 MHz	50 MHz
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B357	S-PBGA-B357
Low Power Mode	NO	YES
Number of Terminals	357	357
Operating Temperature-Max	125 °C
Operating Temperature-Min	-55 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Speed	40 MHz	80 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY
Terminal Form	BALL	BALL
Terminal Position	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR	MICROPROCESSOR, RISC
Base Number Matches	1	1
Rohs Code		No
Factory Lead Time		4 Weeks
Samacsys Manufacturer		NXP
JESD-609 Code		e0
Length		25 mm
Moisture Sensitivity Level		3
Package Equivalence Code		BGA357,19X19,50
Peak Reflow Temperature (Cel)		245
Seated Height-Max		2.52 mm
Terminal Finish		Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Pitch		1.27 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		25 mm
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors