TSPC750AVGB/Q8LH
vs
TSPC750AMGB/Q8LE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
BGA,
,
Pin Count
360
360
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.3 MHz
83.3 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Length
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
360
360
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883 Class B
Seated Height-Max
3.2 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Temperature Grade
MILITARY
Compare TSPC750AVGB/Q8LH with alternatives
Compare TSPC750AMGB/Q8LE with alternatives