TSPC750AMGSU/T8LH
vs
TSXPC750AMGSB/Q8LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
CGA
CGA
Package Description
,
CGA,
Pin Count
360
360
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.3 MHz
83.3 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-C360
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
CGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
200 MHz
200 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
BALL
C BEND
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Rohs Code
Length
25 mm
Moisture Sensitivity Level
1
Screening Level
MIL-STD-883 Class B
Seated Height-Max
4.2 mm
Terminal Pitch
1.27 mm
Width
25 mm
Compare TSPC750AMGSU/T8LH with alternatives
Compare TSXPC750AMGSB/Q8LE with alternatives