TSPC740AVGU/T10LH
vs
TSXPC603RVG12LC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
255
|
255
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
83.3 MHz
|
75 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B255
|
S-CBGA-B255
|
Length |
21 mm
|
21 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
255
|
255
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3 mm
|
3 mm
|
Speed |
233 MHz
|
266 MHz
|
Supply Voltage-Max |
2.7 V
|
2.625 V
|
Supply Voltage-Min |
2.5 V
|
2.375 V
|
Supply Voltage-Nom |
2.6 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
21 mm
|
21 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TSPC740AVGU/T10LH with alternatives
Compare TSXPC603RVG12LC with alternatives