TSN3ATJ330V vs EXB2HV330JV feature comparison

TSN3ATJ330V Tateyama Kagaku Group

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EXB2HV330JV Panasonic Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TATEYAMA KAGAKU GROUP PANASONIC CORP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Construction Chip Rectangular
Network Type ISOLATED ISOLATED
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 3.8 mm 3.8 mm
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method Tape TR, PUNCHED, 7 INCH
Rated Power Dissipation (P) 0.063 W 0.25 W
Resistance 33 Ω 33 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Size Code 1506 0615
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP
HTS Code 8533.21.00.20
Samacsys Manufacturer Panasonic
Additional Feature IEC60115-9
Element Power Dissipation 0.063 W
First Element Resistance 33 Ω
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Elements 1
Number of Functions 8
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard AEC-Q200
Second/Last Element Resistance 33 Ω
Surface Mount YES
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND

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