EXB2HV330JV
vs
TSN3AJ330
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PANASONIC CORP
TATEYAMA KAGAKU GROUP
Package Description
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
Samacsys Manufacturer
Panasonic
Additional Feature
IEC60115-9
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
First Element Resistance
33 Ω
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
Number of Functions
8
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
3.8 mm
3.8 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, PUNCHED, 7 INCH
Bulk
Rated Power Dissipation (P)
0.25 W
0.063 W
Rated Temperature
70 °C
Reference Standard
AEC-Q200
Resistance
33 Ω
33 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
33 Ω
Size Code
0615
1506
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Compare EXB2HV330JV with alternatives
Compare TSN3AJ330 with alternatives