TSN3ATJ330V
vs
CN1F8KTTD330J
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
TATEYAMA KAGAKU GROUP
|
KOA SPEER ELECTRONICS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.45 mm
|
0.45 mm
|
| Package Length |
3.8 mm
|
3.8 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.6 mm
|
1.6 mm
|
| Packing Method |
Tape
|
TR, PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.063 W
|
0.25 W
|
| Resistance |
33 Ω
|
33 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
1506
|
0615
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP, ROHS COMPLIANT
|
| HTS Code |
|
8533.21.00.20
|
| Samacsys Manufacturer |
|
KOA Speer
|
| Element Power Dissipation |
|
0.063 W
|
| First Element Resistance |
|
33 Ω
|
| JESD-609 Code |
|
e3
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Elements |
|
1
|
| Number of Functions |
|
8
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare TSN3ATJ330V with alternatives
Compare CN1F8KTTD330J with alternatives