TSD10L200CWC0G
vs
VS-10CVH02HM3/I
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
R-PSSO-G2
|
DPAK-3/2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW POWER LOSS
|
FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT, SNUBBER DIODE
|
| Application |
EFFICIENCY
|
HYPERFAST SOFT RECOVERY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.98 V
|
1.17 V
|
| JEDEC-95 Code |
TO-263AB
|
TO-252AE
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
| JESD-609 Code |
e3
|
|
| Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
5 A
|
5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
250
|
NOT SPECIFIED
|
| Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
| Reverse Current-Max |
50 µA
|
4 µA
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Vishay
|
| Reference Standard |
|
AEC-Q101
|
| Reverse Recovery Time-Max |
|
0.025 µs
|
|
|
|
Compare TSD10L200CWC0G with alternatives
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