TSC427CPA+
vs
5962-8850301PA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
|
DIP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
NO
|
NO
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDIP-T8
|
R-GDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.375 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Peak Current Limit-Nom |
1.5 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max |
18 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Turn-off Time |
0.06 µs
|
0.06 µs
|
| Turn-on Time |
0.12 µs
|
0.12 µs
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Input Characteristics |
|
STANDARD
|
| Output Characteristics |
|
TOTEM-POLE
|
| Output Polarity |
|
INVERTED
|
|
|
|
Compare TSC427CPA+ with alternatives
Compare 5962-8850301PA with alternatives