TSB80L186EA13 vs SB80C186EB-13 feature comparison

TSB80L186EA13 Intel Corporation

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SB80C186EB-13 Intel Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description LFQFP, SHRINK, QFP-80
Pin Count 80 80
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 26 MHz 26 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 S-PQFP-G80
Length 12 mm 12 mm
Low Power Mode YES YES
Number of DMA Channels 2
Number of External Interrupts 5 6
Number of Serial I/Os 2
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 1.66 mm 1.66 mm
Speed 13 MHz 13 MHz
Supply Current-Max 65 mA 73 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code QFP80,.55SQ,20
Terminal Finish TIN LEAD

Compare TSB80L186EA13 with alternatives

Compare SB80C186EB-13 with alternatives