SB80C186EB-13
vs
SB80C186EA-13
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEL CORP
Package Description
SHRINK, QFP-80
QFP, QFP80,.55SQ,20
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
20
20
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
26 MHz
26 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G80
R-PQFP-G80
Length
12 mm
20 mm
Low Power Mode
YES
YES
Number of Terminals
80
80
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.66 mm
3.15 mm
Speed
13 MHz
13 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
QFP
Pin Count
80
JESD-609 Code
e0
Number of DMA Channels
2
Number of External Interrupts
5
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code
QFP80,.55SQ,20
Power Supplies
5 V
Qualification Status
Not Qualified
RAM (words)
0
Supply Current-Max
65 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare SB80C186EB-13 with alternatives
Compare SB80C186EA-13 with alternatives