TSB80C186EB25
vs
Z8L18033FSC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
ZILOG INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP,
|
QFP,
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
|
ALSO OPERATES AT 3.3V SUPPLY
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
33.33 MHz
|
| External Data Bus Width |
16
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G80
|
R-PQFP-G80
|
| Length |
12 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
6
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
80
|
80
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
1.7 mm
|
3.1 mm
|
| Speed |
25 MHz
|
|
| Supply Current-Max |
115 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TSB80C186EB25 with alternatives
Compare Z8L18033FSC with alternatives