TSB80C186EB25 vs TS80C186EA-13 feature comparison

TSB80C186EB25 Intel Corporation

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TS80C186EA-13 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code QFP
Package Description LFQFP, QFP-80
Pin Count 80
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 26 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
Length 12 mm 20 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os 2
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified
RAM (words) 0
Seated Height-Max 1.7 mm 3.15 mm
Speed 25 MHz 13 MHz
Supply Current-Max 115 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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