TS88915TMWB/T100
vs
TSX88915TVW100
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ATMEL CORP
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
QCCJ,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Conditioning |
MUX
|
MUX
|
JESD-30 Code |
S-CQCC-J28
|
S-CQCC-J28
|
JESD-609 Code |
e0
|
|
Length |
11.43 mm
|
11.43 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.036 A
|
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
1
|
Number of Terminals |
28
|
28
|
Number of True Outputs |
8
|
7
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.75 ns
|
0.75 ns
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
2.99 mm
|
2.99 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.43 mm
|
11.43 mm
|
fmax-Min |
100 MHz
|
100 MHz
|
Base Number Matches |
4
|
3
|
|
|
|
Compare TS88915TMWB/T100 with alternatives
Compare TSX88915TVW100 with alternatives