TS88915TMWB/T100
vs
TS88915TVW100
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
THOMSON-CSF COMPSANTS SPECIFIC
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Conditioning |
MUX
|
|
| JESD-30 Code |
S-CQCC-J28
|
S-XQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11.43 mm
|
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
|
| Max I(ol) |
0.036 A
|
0.036 A
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
28
|
28
|
| Number of True Outputs |
8
|
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.75 ns
|
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
2.99 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
|
| fmax-Min |
100 MHz
|
|
| Base Number Matches |
4
|
4
|
|
|
|
Compare TS88915TMWB/T100 with alternatives