TS68EN360MR33
vs
TS68EN360MRB/C25L
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
E2V TECHNOLOGIES PLC
|
| Package Description |
PGA, PGA241M,18X18
|
CAVITY UP, CERAMIC, PGA-241
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XPGA-P241
|
S-CPGA-P241
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
241
|
241
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Equivalence Code |
PGA241M,18X18
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
327 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
PGA
|
| Pin Count |
|
241
|
| ECCN Code |
|
3A001.A.2.C
|
| Length |
|
47.245 mm
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Seated Height-Max |
|
4.96 mm
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Width |
|
47.245 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
Compare TS68EN360MRB/C25L with alternatives