TS68EN360MRB/C25L vs TS68EN360MRB/C33 feature comparison

TS68EN360MRB/C25L Atmel Corporation

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TS68EN360MRB/C33 Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code PGA
Package Description PGA, PGA241M,18X18 PGA, PGA241M,18X18
Pin Count 241
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P241 S-XPGA-P241
JESD-609 Code e0 e0
Length 47.245 mm
Number of Terminals 241 241
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code PGA PGA
Package Equivalence Code PGA241M,18X18 PGA241M,18X18
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B 38535Q/M;38534H;883B
Seated Height-Max 4.96 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 47.245 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Base Number Matches 2 3
Supply Current-Max 327 mA

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