TS68EN360MR25L vs TS68EN360MR1B/Q25L feature comparison

TS68EN360MR25L Atmel Corporation

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TS68EN360MR1B/Q25L Atmel Corporation

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code PGA PGA
Package Description PGA, PGA241M,18X18 PGA,
Pin Count 241 241
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 25 MHz 25 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CPGA-P241 S-CPGA-P241
JESD-609 Code e0 e3
Length 47.245 mm 47.245 mm
Low Power Mode YES YES
Number of Terminals 241 241
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Equivalence Code PGA241M,18X18
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.96 mm 4.96 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 47.245 mm 47.245 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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Compare TS68EN360MR1B/Q25L with alternatives