TS68882MRB/C16
vs
5962-8946301XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
MOTOROLA INC
Part Package Code
PGA
Package Description
,
PGA,
Pin Count
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.39.00.01
JESD-30 Code
S-CPGA-P68
S-CPGA-P68
Number of Terminals
68
68
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883 Class B
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HCMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Address Bus Width
5
Barrel Shifter
YES
Boundary Scan
NO
Clock Frequency-Max
16.7 MHz
External Data Bus Width
32
Package Code
PGA
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
150 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare TS68882MRB/C16 with alternatives
Compare 5962-8946301XX with alternatives