TS68882MR33
vs
TS68882MF25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
PGA
QFP
Package Description
PGA, PGA68,10X10
QFP, QFP68,1.1SQ,50
Pin Count
68
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CPGA-P68
S-CQFP-G68
JESD-609 Code
e0
e0
Length
26.92 mm
24.13 mm
Number of Terminals
68
68
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QFP
Package Equivalence Code
PGA68,10X10
QFP68,1.1SQ,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.184 mm
3.43 mm
Supply Current-Max
136 mA
136 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Width
26.92 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Address Bus Width
5
Boundary Scan
NO
Clock Frequency-Max
25 MHz
External Data Bus Width
32
Screening Level
MIL-STD-883 Class B
Compare TS68882MR33 with alternatives
Compare TS68882MF25 with alternatives