TS68882DESC04YA
vs
TS68882MRB/C16
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ATMEL CORP
THOMSON-CSF SEMICONDUCTORS
Part Package Code
QFP
PGA
Package Description
QFP, QFP68,1.1SQ,50
,
Pin Count
68
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CQFP-G68
S-CPGA-P68
JESD-609 Code
e0
Length
24.13 mm
Number of Terminals
68
68
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
Package Equivalence Code
QFP68,1.1SQ,50
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.43 mm
Supply Current-Max
136 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
1.27 mm
Terminal Position
QUAD
PERPENDICULAR
Width
24.13 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
5
6
Screening Level
MIL-STD-883 Class B
Compare TS68882DESC04YA with alternatives
Compare TS68882MRB/C16 with alternatives