TS68882DESC03YA vs MC68882RC33 feature comparison

TS68882DESC03YA Atmel Corporation

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MC68882RC33 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP MOTOROLA INC
Part Package Code QFP PGA
Package Description QFP, QFP68,1.1SQ,50 PGA,
Pin Count 68 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CQFP-G68 S-CPGA-P68
JESD-609 Code e0 e0
Length 24.13 mm 26.92 mm
Number of Terminals 68 68
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFP PGA
Package Equivalence Code QFP68,1.1SQ,50
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.43 mm 2.59 mm
Supply Current-Max 136 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb)
Terminal Form GULL WING PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.13 mm 26.92 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 5 4
Address Bus Width 5
Barrel Shifter YES
Boundary Scan NO
Bus Compatibility MC68020; MC68030
Clock Frequency-Max 33.33 MHz
External Data Bus Width 32

Compare TS68882DESC03YA with alternatives

Compare MC68882RC33 with alternatives