TS68882DESC01YA
vs
SPAK68882FN25A
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
LCC
|
| Package Description |
QFP, QFP68,1.1SQ,50
|
QCCJ,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-CQFP-G68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
|
| Length |
24.13 mm
|
24.2062 mm
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP68,1.1SQ,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.43 mm
|
4.57 mm
|
| Supply Current-Max |
136 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
24.2062 mm
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Address Bus Width |
|
5
|
| Boundary Scan |
|
NO
|
| Bus Compatibility |
|
MC68020; MC68030
|
| Clock Frequency-Max |
|
25 MHz
|
| External Data Bus Width |
|
32
|
|
|
|
Compare TS68882DESC01YA with alternatives
Compare SPAK68882FN25A with alternatives