TS68000VC10
vs
TSX68C000MC10A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
E2V TECHNOLOGIES PLC
Part Package Code
DIP
DIP
Package Description
,
DIP,
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Category CO2 Kg
12.2
Compliance Temperature Grade
Industrial: -40C to +85C
Address Bus Width
24
24
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T64
R-CDIP-T64
Number of Terminals
64
64
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
10 MHz
10 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HMOS
HCMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
Length
81.28 mm
Low Power Mode
NO
Seated Height-Max
4.83 mm
Terminal Pitch
2.54 mm
Width
22.86 mm
Compare TS68000VC10 with alternatives
Compare TSX68C000MC10A with alternatives