TS68000VC10
vs
5962-8766501XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
THOMSON-CSF COMPSANTS SPECIFIC
PYRAMID SEMICONDUCTOR CORP
Package Description
,
DIP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
64
ECCN Code
3A001.A.2.C
Address Bus Width
16
Bit Size
16
Boundary Scan
NO
Clock Frequency-Max
15 MHz
External Data Bus Width
16
Format
FLOATING POINT
Integrated Cache
NO
JESD-30 Code
R-XDIP-T64
Length
42.2402 mm
Low Power Mode
YES
Number of Terminals
64
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
4.191 mm
Speed
15 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
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