TS556CD vs TS555MD feature comparison

TS556CD STMicroelectronics

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TS555MD STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description MICRO, PLASTIC, SO-14 SOP, SOP8,.25
Pin Count 14 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G14 R-PDSO-G8
JESD-609 Code e4 e4
Length 8.65 mm 4.9 mm
Moisture Sensitivity Level 1 1
Number of Functions 2 1
Number of Terminals 14 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Frequency-Max 2 MHz 2 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm 3.9 mm
Base Number Matches 1 1

Compare TS556CD with alternatives

Compare TS555MD with alternatives