TS556CD
vs
NE555V
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SIGNETICS CORP
Part Package Code
SOIC
Package Description
MICRO, PLASTIC, SO-14
DIP, DIP8,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
STMicroelectronics
Additional Feature
IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-PDSO-G14
R-PDIP-T8
JESD-609 Code
e4
e0
Length
8.65 mm
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Terminals
14
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Frequency-Max
2 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
16 V
16 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
3.9 mm
Base Number Matches
1
6
Supply Current-Max (Isup)
15 mA
Compare TS556CD with alternatives
Compare NE555V with alternatives