TS4984IQT
vs
SSM2304CPZ-REEL7
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
4 X 4 MM, 0.50 MM PITCH, LEAD FREE, TQFN-16
|
3 X 3 MM, LEAD FREE, MO-220VEED-2, LFCSP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
STMicroelectronics
|
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Harmonic Distortion |
1%
|
1%
|
JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
|
Length |
4 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1 W
|
1.8 W
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.16SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Current-Max |
12 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5 V
|
Supply Voltage-Min (Vsup) |
2.2 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
NOT SPECIFIED
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
4 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Gain |
|
18 dB
|
|
|
|
Compare TS4984IQT with alternatives
Compare SSM2304CPZ-REEL7 with alternatives