TS3A26746EYZPR
vs
TLV321AC36CPT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
DSBGA-6
|
LFQFP,
|
| Pin Count |
6
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
R-XBGA-B6
|
S-PQFP-G48
|
| JESD-609 Code |
e1
|
|
| Length |
1.4 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
48
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
LFQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.6 mm
|
| Supply Current-Max |
0.05 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
BASEBAND CIRCUIT
|
BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
0.9 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare TS3A26746EYZPR with alternatives
Compare TLV321AC36CPT with alternatives