TS2012EIJT
vs
TPA2026D2YZHR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
2.10 X 2.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, FLIP CHIP PACKAGE, 16 PIN
|
DSBGA-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
Texas Instruments
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
JESD-30 Code |
S-PBGA-B16
|
R-XBGA-B16
|
Length |
2.1 mm
|
2.134 mm
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2.5 W
|
3.2 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
FBGA
|
VFBGA
|
Package Equivalence Code |
BGA16,4X4,20
|
BGA16,4X4,20
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
2.1 mm
|
2.112 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
1
|
Noise Figure-Nom |
|
95 dB
|
Seated Height-Max |
|
0.625 mm
|
Supply Current-Max |
|
5.5 mA
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare TS2012EIJT with alternatives
Compare TPA2026D2YZHR with alternatives