TS(X)PC860MHVZPU/T40(A) vs TS(X)PC860MHVZPU40C feature comparison

TS(X)PC860MHVZPU/T40(A) Thales Group

Buy Now Datasheet

TS(X)PC860MHVZPU40C Teledyne e2v

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS ATMEL GRENOBLE
Part Package Code BGA BGA
Package Description , ,
Pin Count 357 357
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Low Power Mode NO NO
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 40 MHz 40 MHz
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Clock Frequency-Max 40 MHz
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Temperature Grade INDUSTRIAL

Compare TS(X)PC860MHVZPU/T40(A) with alternatives

Compare TS(X)PC860MHVZPU40C with alternatives