TS(X)PC860MHVZPB/C40(A) vs TS(X)PC860MHMZPU/T50C feature comparison

TS(X)PC860MHVZPB/C40(A) Thales Group

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TS(X)PC860MHMZPU/T50C Teledyne e2v

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS ATMEL GRENOBLE
Part Package Code BGA BGA
Package Description , ,
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Low Power Mode NO NO
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Speed 40 MHz 50 MHz
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 2
Clock Frequency-Max 50 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Temperature Grade MILITARY

Compare TS(X)PC860MHVZPB/C40(A) with alternatives

Compare TS(X)PC860MHMZPU/T50C with alternatives