TS(X)PC860MHVZPB/C40(A)
vs
TS(X)PC860MHMZPB/Q50A3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL GRENOBLE
Part Package Code
BGA
BGA
Package Description
,
,
Pin Count
357
357
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Low Power Mode
NO
NO
Number of Terminals
357
357
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Speed
40 MHz
50 MHz
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
2
Clock Frequency-Max
50 MHz
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Temperature Grade
MILITARY
Compare TS(X)PC860MHVZPB/C40(A) with alternatives
Compare TS(X)PC860MHMZPB/Q50A3 with alternatives